R&D Engineer - IC Packaging Design/Development
Posted on: 26 Oct 2021
San Jose, CA
Job Description
Job Description:
Work with cross-functional teams to select the optimized package solution
Work with IC design, system design, package SI/PI & thermal engineering teams to design custom packages
Work with SoC design teams to optimize die floorplan & bump patterns
Manage packaging activity from concept through substrate design, development, qualification and high volume production.
Define assembly BOM, process, troubleshoot and provide sustaining support on packaging issues
Create package design documentation and assembly instructions
Work with overseas assembly partners for product bring-up, qualification and ramp to HVM
Job Requirements
BS/MS in Electrical/Mechanical Engineering
Experience: 3+ years in IC packaging, substrate design, and assembly
Strong authority on Cadence Allegro Package Designer (APD)
Hands-on expertise of assembly processes for flip-chip BGA, wire bond, module/SiP & WLCSP packages
Knowledge of substrate manufacturing is plus
Knowledge of failure analysis techniques
Strong project management skills
Strong communication skills for working with cross functional internal teams and overseas suppliers
Broadcom
San Jose, CA
Broadcom Inc. designs, develops, and supplies a range of semiconductor devices with a focus on complex digital and mixed signal complementary metal oxide semiconductor based devices and analog III-V based products worldwide. The company operates through four segments: Wired Infrastructure, Wireless Communications, Enterprise Storage, and Industrial & Other. The Wired Infrastructure segment provides set-top box system-on-chips (SoCs); cable, digital subscriber line, and passive optical networking central office/consumer premise equipment SoCs; Ethernet switching and routing application specific standard products; embedded processors and controllers; serializer/deserializer application specific integrated circuits; optical and copper, and physical layers; and fiber optic laser and receiver components.
The Wireless Communications segment offers RF front end modules, filters, and power amplifiers; Wi-Fi, Bluetooth, and global positioning system/global navigation satellite system SoCs; and custom touch controllers. The Enterprise Storage segment provides serial attached small computer system interface, and redundant array of independent disks controllers and adapters; peripheral component interconnect express switches; fiber channel host bus adapters and switches; read channel based SoCs; custom flash controllers; and preamplifiers.
The Industrial & Other segment offers optocouplers, industrial fiber optics, motion control encoders and subsystems, and light emitting diodes. The company’s products are used in various applications, including enterprise and data center networking, home connectivity, set-top boxes, broadband access, telecommunication equipment, smartphones and base stations, data center servers and storage systems, factory automation, power generation and alternative energy systems, and electronic displays. Broadcom Inc. is headquartered in San Jose, California.
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IndustryInformation Technology
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No. of Employees15,000
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Website
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Jobs Posted221
