Job Description

The FRL team is building products that make it easier for people to connect with the ones they love most. We are a team of world-class experts developing and shipping products at the intersection of hardware, software, and content. Our team has the responsibility for taking breakthrough concepts and delivering them to market at scale. The FRL team seeks an Engineer who has experience in building System in package or System in Module for space constrained consumer electronics and battery operated mobile products.

FRL System in Package (SiP) Engineer Responsibilities

* Explore, develop and deploy system in package module technologies in high volume manufacturing.

* Define substrate stackup, placement, materials, process flow, test vehicle(s), and test/validation methodology to build a reliable SiP module for mass production.

* Interface with vendors and suppliers and collaborate with internal cross functional teams to develop new technologies needed to build world class and cost effective SiP modules.

* Collaborate with module/technology teams and create validation plans to characterize SiP performance and system co-existence testing.

* Drive the resolution of SiP related technical issue by collaborating with internal and external partners leveraging I/V curve trace, physical analysis, surface analysis, structural analysis, and functional debug.

* Support technical program manager in planning, executing, and tracking progress of complex process or product development and regular updates to management on program status.

Minimum Qualifications

* BS or MS in Electrical Engineering or related fields or equivalent experience

* 5+ years of experience in consumer electronics, silicon packaging or related fields

* 5+ years of experience in embedded or mobile system design, board/SiP design, bring-up, test, and product NPI experience

* 2+ years of experience in building and integrating System in Module or System in Package for space constrained products

* Experience in defining test methodologies to qualify functionality and reliability of System in Package

* Experience with advanced printed circuit board (PCB) technologies, SiP module, SMT, advanced manufacturing processes and packaging technologies

* Experience leading technical teams, cross-functional groups and vendors against plans

Preferred Qualifications

* Experience with bringing new technologies to production

* Experience with characterization and statistical data analysis

* Experience with understanding the relationship between physical layout and electrical performance

* Experience with silicon packaging technologies and packaging trends

Locations

About the Facebook company

Facebook's mission is to give people the power to build community and bring the world closer together. Through our family of apps and services, we're building a different kind of company that connects billions of people around the world, gives them ways to share what matters most to them, and helps bring people closer together. Whether we're creating new products or helping a small business expand its reach, people at Facebook are builders at heart. Our global teams are constantly iterating, solving problems, and working together to empower people around the world to build community and connect in meaningful ways. Together, we can help people build stronger communities we're just getting started.

Facebook is committed to providing reasonable support (called accommodations) in our recruiting processes for candidates with disabilities, long term conditions, mental health conditions or who are neurodivergent, and to candidates with sincerely held religious beliefs or requiring pregnancy related support. If you need support, please reach out to accommodations-ext@fb.com.