Job Description

Job Description

The job responsibility includes:

* Developing packaging design for state of the art Silicon Photonics (SiPh) devices and assemblies.

* Defining thermal design pathfinding activities aligned with product roadmap.

* Provide design guidance through-out product development cycle by conducting thermal and stress simulation. Assess and mitigate risks associated with the design options.

* Conduct detailed design simulation and validate/correlate simulation result thru data collection and measurement.

* Identify new thermal management solutions and suppliers to improve product performance.

Additional Skills:

* Excellent verbal and written communication, interpersonal skill.

* Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals.

* Work independently with limited direction, as well as in a team environment across functional and organizational boundaries is required.

* Work with multiple priorities and deliver against a schedule.

* Team player with good communication skills.

Qualifications

Minimum Qualifications

The candidate under consideration should be meeting the following qualifications:

* BS degree in Mechanical Engineering or related field.

* 4+ years of experience in product thermal design in semiconductor or optical transceiver industry, proficiency in ICEPAK and/or FLOTHERM modeling.

* 1+ years of experience on thermal interface materials and thermal management solutions such as heat sinks, fans, heat pipe etc.

* 1+ years of experience with product design simulation for stress and thermal.

Preferred Qualifications

* 1+ years of experience in packaging assembly process. Be willing to correctly define the boundary conditions for the simulation problem.

* 1+ years of experience in FEA structural analysis and knowledgeable on Abaqus or ANSYS modeling tools.

* 1+ years of design experience in high volume product environment such as optical transceivers, cell phones, disk drives or automation.

* 2+ years of experience in 3D design software such as Solidworks and enterprise data management system such as ePDM.

* 1+ years of experience in transceiver module assembly processes.

* 1+ years of proven experience in executing complex projects
Inside this Business Group
The Data Center Group (DCG) is at the heart of Intels transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologiesspanning software, processors, storage, I/O, and networking solutionsthat fuel cloud, communications, enterprise, and government data centers around the world.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USExperienced HireJR0149929Santa Clara