Job Description
This is a 3-month internship position in Intel's Heterogeneous Platforms Research Lab. Candidate will be contributing to Intel's multi-die integration research. Research activities include research and design of memory blocks, memory interfaces, clocking and IO circuits. The research will also involve die-package interface simulations with modeling of new die attachment technologies.
Qualifications
Minimum Qualifications:
- Candidate must be pursuing a Ph.D. degree in Electrical Engineering, Computer Engineering or Computer Science.
At least 6+ months of work or educational experience in the following areas:
- Digital design and RTL experience
- Special purpose accelerators design
- Media inference applications
- Memory hierarchy and near-memory compute accelerators
- Complementary Metal-Oxide Semiconductor (CMOS) chip design
Preferred qualifications:
- Experience in media and machine learning algorithms.
- Experience with Hardware-Software co-design.
Inside this Business Group
Intel Labs is the company's world-class, industry leading research organization, responsible for driving Intel's technology pipeline and creating new opportunities. The mission of Intel Labs is to deliver breakthrough technologies to fuel Intel's growth. This includes identifying and exploring compelling new technologies and high risk opportunities ahead of business unit investment and demonstrating first-to-market technologies and innovative new usages for computing technology. Intel Labs engages the leading thinkers in academia and industry in addition to partnering closely with Intel business units.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
USInternJR0156979Hillsboro
Santa Clara, CA
Intel Corporation offers computing, networking, data storage, and communication solutions worldwide. It operates through Client Computing Group, Data Center Group, Internet of Things Group, Non-Volatile Memory Solutions Group, Programmable Solutions Group, and All Other segments. The company offers microprocessors, and system-on-chip and multichip packaging products.
It also provides NAND flash memory products primarily used in solid-state drives; and programmable semiconductors and related products for communications, data center, industrial, and military markets. In addition, the company develops computer vision and machine learning, data analysis, localization, and mapping for advanced driver assistance systems and autonomous driving. Its platforms are used in notebooks, systems, and desktops; cloud, enterprise, and communication infrastructure market segments; and retail, automotive, industrial, and various other embedded applications.
It serves original equipment manufacturers, original design manufacturers, industrial and communication equipment manufacturers, and cloud service providers. Intel Corporation has a collaboration with Telefonaktiebolaget LM Ericsson (publ) to develop software defined infrastructure for network functions virtualization, distributed cloud, and 5G applications. The company was founded in 1968 and is based in Santa Clara, California.