Job Description
TD Yield and Integration engineers in NSG are responsible for leading research and development in order to architect, develop and deliver leading edge 3D NAND nonvolatile memory technologies to high volume manufacturing. Contribute to defining process and device architectures, technology collaterals as well as develop scaling paths for leading edge memory technologies.Designing, executing and analyzing experiments necessary to meet engineering specifications for their process. Participate in development of intellectual property. Operate manufacturing line in order to integrate the many individual steps necessary for the manufacture of complex New architectures. In-situ ramp to manufacturing volumes to demonstrate the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing. The scope includes development of new types of process and device architectures involving novel materials, structures and integration schemes to deliver industry leadership in density, performance, reliability and cost. Collaborate with technology development partners in defining goals, developing the vision, aligning strategy and driving fast paced silicon development to meet aggressive technology node cadences. In addition , work closely with the product, test, and system teams to ensure seamless integration of the memory components into Intel system products as well as with the high volume manufacturing Fabs to ensure a seamless technology transfer and ramp to support the full envelope of component and system products. Your new position is associated with the sale of Intel's NAND memory and storage business to SK hynix. (You can read more about the transaction in the press release). The transaction will enhance the resources and potential of the business' storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data. In your role, you will be part of a world-class team that will transition to lead the SSD business at SK hynix. This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK hynix.
Qualifications
Qualifications: Must possess a Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry or Chemical Engineering. Additional qualifications include: - Minimum 5 years of direct experiences in technology development, integration, device, yield analysis organizations is required. - Direct experience in 3D NAND technology development, transfer, ramping and sustaining are preferred. - A proven history of technical problem solving through the creation of solutions that demonstrated creativity and out-of-box thinking. Statistical/data analysis (JMP, SQL, Python, Excel, , etc) Excellent data extraction and analysis skills, and well versed in DOE principles. - Understanding of device physics in deciphering parametric data, and Semiconductor materials and characterization are required - Ability to multi-task and be effective in providing timely solutions. -Strong organizational and communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
Other Locations
PRC, Dalian
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
USExperienced HireJR0151243Boise
Santa Clara, CA
Intel Corporation offers computing, networking, data storage, and communication solutions worldwide. It operates through Client Computing Group, Data Center Group, Internet of Things Group, Non-Volatile Memory Solutions Group, Programmable Solutions Group, and All Other segments. The company offers microprocessors, and system-on-chip and multichip packaging products.
It also provides NAND flash memory products primarily used in solid-state drives; and programmable semiconductors and related products for communications, data center, industrial, and military markets. In addition, the company develops computer vision and machine learning, data analysis, localization, and mapping for advanced driver assistance systems and autonomous driving. Its platforms are used in notebooks, systems, and desktops; cloud, enterprise, and communication infrastructure market segments; and retail, automotive, industrial, and various other embedded applications.
It serves original equipment manufacturers, original design manufacturers, industrial and communication equipment manufacturers, and cloud service providers. Intel Corporation has a collaboration with Telefonaktiebolaget LM Ericsson (publ) to develop software defined infrastructure for network functions virtualization, distributed cloud, and 5G applications. The company was founded in 1968 and is based in Santa Clara, California.