Job Description
The Full-Chip Integration team is looking for an SoC Design Engineer to join Design Enablement (DE) team in Technology Development Organization (TD). The charter of the team is to develop physical design methodology for Test Chip lead vehicles which are primarily used for Intel's next generation process development and high-volume certification. The specific role focuses in the layout domain and encompasses engagement with manufacturing on cutting-edge process nodes, facilitation of hierarchical layout convergence and correct-by-construction assembly, IP integration oversight, driving and qualification of design to meet tape-in requirements, and delivery of SOC design to manufacturing.
As a SoC Design Engineer, your responsibilities will include but not be limited to:
* Developing layout design methodology and productivity automation for cutting edge process nodes
* Working closely with LTD Process Engineers to define critical Design features that needs to be exercised in the early lead vehicle test chips.
* Establishing, orchestrating, overseeing, and maintaining hierarchical layout design specifications for correct-by-construction integration
* Building and executing tactical plans to converge hierarchical SOC layout design against aggressive schedule requirements
* Orchestrating mock full-chip assembly and tape-ins in preparation for the real thing and to provide package and tape-out partners with representative data for planning and product prep
* Building and supporting tools, capabilities, methods, and work models for global layout design and convergence
* Driving all aspects of physical design convergence, including preparing layout hierarchy for design tape-in, debugging and resolving issues uncovered by verification tools
* Working with tool/flow owners and vendors for ongoing tool/methodology improvement
* Success in this job requires working closely with Engineering, DAs, and manufacturing partners with a goal to robustly tape-in a complex multi-hierarchical SOC within hours of final block completion.
The ideal candidate should exhibit the following behavioral traits:
* Verbal and written communication skills
* Ability to work well both autonomously and in an intensive, cooperative team environment
* Exhibiting strong interest in Layout design
* Motivation to continuously learn and drive to push improved layout productivity and efficiency
Qualifications
You must possess minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences.
Minimum Qualifications:
Master's degree in EE or ECE with 1+ years in the following areas:
* Hands-on experience with state-of-the-art floorplan, layout design, and verification CAD tools
* Experience with layout design rule
* Knowledge of Chip floor planning, layout integration, layout design rules and schematic/layout comparison debug and validation
* Software and coding skills (Perl, Python, SKILL and/or Tcl)
* Comprehension of electrical behavior of materials and insight into ways to improve reliability and manufacturability.
Preferred Qualifications:
* Floorplanning with ICC2-DP and ability to customize the flow based on design needs.
* Exposure to Runset development using ICV/Calibre to facilitate automation to improve layout productivity.
* Knowledge on Semiconductor device physics
* Proven Project Management skills on coordinating and tracking the entire design cycle of a project from Feature definition to final Tape-in.
designenablement
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
USCollege GradJR0158069Hillsboro
Santa Clara, CA
Intel Corporation offers computing, networking, data storage, and communication solutions worldwide. It operates through Client Computing Group, Data Center Group, Internet of Things Group, Non-Volatile Memory Solutions Group, Programmable Solutions Group, and All Other segments. The company offers microprocessors, and system-on-chip and multichip packaging products.
It also provides NAND flash memory products primarily used in solid-state drives; and programmable semiconductors and related products for communications, data center, industrial, and military markets. In addition, the company develops computer vision and machine learning, data analysis, localization, and mapping for advanced driver assistance systems and autonomous driving. Its platforms are used in notebooks, systems, and desktops; cloud, enterprise, and communication infrastructure market segments; and retail, automotive, industrial, and various other embedded applications.
It serves original equipment manufacturers, original design manufacturers, industrial and communication equipment manufacturers, and cloud service providers. Intel Corporation has a collaboration with Telefonaktiebolaget LM Ericsson (publ) to develop software defined infrastructure for network functions virtualization, distributed cloud, and 5G applications. The company was founded in 1968 and is based in Santa Clara, California.