Job Description

Job Description

This position is associated with the sale of Intels NAND memory and storage business to SK hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.

This is an exciting time to be at Intel come join our team as a Staff / Snr Staff Process Engineer - Wets and work on one of the most advanced 3DNAND and SSD technology portfolios in the world. As the global leader in the semiconductor industry, Intel possesses many industry-leading SSD technologies including the most capable Quadruple Level Cell (QLC) NAND Flash products. As a Staff / Snr Staff Process Engineer - Wets, you will be part of a world-class team that will transition to lead the SSD business at SK hynix.

This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK hynix.

Intel's Non-Volatile Memory Solutions Group is hiring experienced Process Development Engineers in the process area of Wet Etch to develop world class semiconductor manufacturing processes. The ideal candidate will have a successful track record of delivering leading edge process capability, yield, cost and manufacturability. This will involve exceptional collaboration with cross-functional, cross-company, cross -geo teams and tool vendors to meet device requirements for next-generation memory products. In addition to Wet Etch you will also be responsible for process module development for memory devices. Relocation assistance available if need it.

Job responsibilities may include, but not limited:

* Design and optimize Wet Etch processes for leading edge memory technology.

* Defining and establishing flow, procedures, and equipment configuration for the module.

* Selecting and developing material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

* Conducting process, equipment and material development projects with equipment and material suppliers. This will involve exceptional collaboration with cross-functional/cross-company teams and tool vendors to meet challenging program goals.

* Designing, executing and analyzing experiments necessary to meet engineering specifications for their process.

* Working effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues.

* Driving improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel.

* Developing solutions to problems utilizing formal education, statistical knowledge, and problem solving tools.

* Establishing process control systems for the process module.

* Training production/receiving process engineers in high volume factories.

* Transferring processes to high volume manufacturing and providing support in new factory startup.

* Domestic and International travel, as necessary to support job responsibilities

* Identify potential intellectual properties (IP) opportunities and file disclosures

Qualifications

The below minimum qualifications must be met to be considered for this position.

Minimum Qualifications:

* PhD degree or MS in Chemical Engineering, Material Science, Chemistry or an equivalent field.

* Minimum 6+ years of hands-on experience in Semiconductor FAB processing and/or equipment development.

* Experience of Wet etch & cleans fundamentals, transport phenomena, fluid mechanics, reaction engineering and interactions pertaining to high aspect ratio features.

* Experience in developing Wets process for leading technology nodes and scaling them up to HVM. Understands interactions between process, tool and /down-stream processes.

* Experience working with external and internal partners, including semiconductor equipment and/or materials manufacturers.

* Understanding of surface and analytical characterization techniques such as ICPMS, SIMS, XPS, SEM, TEM, etc.

Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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