Job Description

Job Description

In this position, you will be working as a lead member or manager of the Non-Volatile Memory (NVM) Solutions Group's (NSG's) Quality and Reliability team, supporting development of Intel's new emerging NVM 3D-NAND technologies and SSD products, focusing on CMOS transistor reliability. This position is flexible as a lead individual contributor or lead management role depending on the candidate's technical and leadership experience. This position is associated with the sale of Intel's NAND memory and storagebusiness to SK hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business' storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data. This is an exciting time to be at Intel - come join our CMOS TD Reliability Team and work on one of the most advanced 3DNAND and SSD technology portfolios in the world. As the global leader in the semiconductor industry, Intel possesses many industry-leading SSD technologies including the most capable Quadruple Level Cell (QLC) NAND Flash products. In this role, you will be part of a world-class team that will transition to lead the SSD business at SK hynix. This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK hynix. Your responsibilities will include but not limited to: Provide technical leadership in CMOS Reliability methodology, characterizing and testing of device and interconnect (FEOL & BEOL) reliability. The scope of the job may extend to leading the team and providing management guidance to important projects. Work closely with Design Engineering to enhance aging model incorporation methodologies in key analog and digital circuits, enhancing methods for circuit reliability validation, SOA checking to enhance built-in reliability. Working in conjunction with process integration and device engineers to provide reliability feedback during technology development. Supporting intrinsic device and interconnect level qualification. Work closely with Product Engineering and Product Reliability teams for enhanced product screen development, provide guidelines for intrinsic mechanisms. Developing empirical and physics-based predictive reliability modeling methods and tools for reliability risk assessments. Determining reliability requirements and technology targets of components to achieve company, customer and other reliability objectives. Influencing design, process, product, test and/or system solutions in order to enable aggressive scaling of Intel's NVM technologies You may also be expected to lead a small team of engineers to work collaboratively with internal and external stakeholders and be the point of communication with management for leading key projects. You may be expected to lead or work in cross-functional and cross-company groups of engineers on multi-disciplinary technical projects to solve complex reliability issues- such as, during technology development and ramp to high-volume manufacturing.

Qualifications

Minimum Qualifications: You must possess the minimum qualifications below to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. 8 years of experience outside academia relevant to CMOS device and interconnect FEOL and BEOL reliability Solid understanding of semiconductor device physics, reliability physics, materials science, probability and statistics, circuit design, semiconductor processing 8 years of experience with test equipment such as semiconductor parametric analyzer CV-IV, probe stations, pulse generators, oscilloscopes, etc. for electrical characterization of electronic materials and devices Preferred qualifications: Technical skills: 12-15 years of experience in CMOS transistor reliability (TDDB, HCI, NBTI, PBTI), inter-metal dielectric reliability and EM. Experience in supporting technology development with reliability feedback, segmentation experience and willingness to deal with novel reliability challenges. Leadership experience in technical and personnel management, team-building and liaising with cross-functional teams like technology development, design and product engineering. Data-driven decision-making skills, motivator, with concise communication skills up and down management levels. Experience and proficiency in transistor device modeling, characterization, data analysis and reliability projection methodologies Proficiency in reliability failure statistics, physics, or reliability failure mechanisms Experience with test equipment such as semiconductor parametric analyzer CV-IV, pulse generators, oscilloscopes, etc. for electrical characterization of electronic materials and devices. Skills or experience in testing, data acquisition, reduction and analysis, statistical analysis packages. An advanced degree (Ph.D. or M.S.) in Electrical Engineering, Physics, Materials Science, or Computer Engineering. Performance skills: Demonstrated ability to solve technical problems and provide workable solutions Ability to work well in a team setting with people from a wide range of backgrounds Demonstrated ability to work in a fast-paced dynamic environment Demonstrated persistence and commitment to achieving results Ability to clearly communicate achieved results and to influence wide range of audiences

Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USExperienced HireJR0153447Folsom