Job Description

About TI

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!

About the job

Do you want to work for an organization that values your opinion? Do you want to work for an organization where you can play a pivotal role in several different areas? Look no further. As a Texas Instruments Product Engineer, you will have the opportunity to work in a vibrant and dynamic team oriented environment with exposure to a variety of state-of-the art applications each day.

Responsibilities may include:

As a NPDE product engineer in the Buck Switching Regulators team, you will be providing a key role in new product development from KO to RTM.

You will be working with cross-functional teams from the planning phase to align on the project schedule, test methodology, qualification, and characterization plan.

You will be driving the technical activities to qualify new products including development milestones, risk assessment and mitigation, review qual and test plans, data analysis, documentation, manufacturing approval, and product release.

You will be driving activities for cost reduction, capacity expansion, and quality enhancement, including manufacturing platform simplifications, process/package/test optimization.

Manage production escalation with engineers at the factory, assess risk and make disposition decisions on production material with Manufacturing and Quality teams.

Apply proven problem-solving methodologies such as 8D, 4C, failure analysis, experimental design, statistical analysis, and bench testing to resolve yield and quality issues.

Responsibilities will include supporting datasheet requirements, ATE Characterizations, Burn-in, hardware development, and ATE test program debug.

Work with the QRE team to generated silicon and package qualification plan for custom and catalog devices.

Managing board level reliability (BLR) tests including defining specs, data analysis, and review.

Manage VVCM for ATE characterization data upload, test conditions, and review.

Working with Fab to define process DOE, run characterization over PVT, generate reports and provide analysis, setting up reviews with design, test, and system teams.

Responsible for YE and TTR activities to meet DD yield while working with Fab and A/T sites.

Qual HW design for dynamic HTOL and Biased HAST, including pattern generation and measurements.

Running GRR analysis before starting qual and transferring the test program for offshore production.

Customer returns analysis and driving meetings to find the root cause and implement corrective actions.

Qualifications

Minimum requirements:

Bachelor’s degree in Electrical Engineering or related field

3 year’s of relevant experience

Preferred qualifications:

Solid understanding of analog and digital circuits their operation and analysis

The preferred candidate should know about IC packaging.

Be able to lead the package co-design effort with SCP, Systems, Design teams, which would include Electrical and Thermal modeling using Thermal Explorer or Celsius and ANSYS tools.

The ideal candidate should be able to understand the design schematic.

Should be able to identify test issues, check and debug test programs, and add coverage if needed.

Hardware design for dynamic HTOL, bHAST, FA - know parasitic extraction tools ex. ANSYS for optimal design.

Should possess expertise in device qualification, understand the purpose of silicon and package qualification, and how the stress is performed in the lab and the lab equipment.

Should be familiar with using lab equipment such as PCI-X, Keithley, Oscilloscope, etc to set up a bench and do the debug or correlation measurement as needed.

Knowledge of device physics, and be able to analyze fab parametric data, review PCD specs, and can define process splits based on components used and simulation data.

Must possess a good understanding of failure analysis, and be able to help FA lab with device setups using

EVM's or validation board.

Must have good knowledge of material science and be able to comprehend the package BOM, impact, and challenges when it comes to manufacturability and qualification.

Should be an expert in statistical data analysis and have a fundamental knowledge of data processing.

Understanding the device spec, test program, and methodologies to help support manufacturing sites and address yield issues.

Knowledge of manufacturing tools, processes, and steps, to help identify issues and diligently communicate with the production sites.

Must be able to use multiple data analysis tools, Mbayse, Spotfire, DataWare, or able to write scripts based on the need and be able to identify any issues, such as hardware/setup, test program, device, etc.

Understanding of TI database, and able to drive data-based decisions by extracting any set of data ex. WAT, Bump, AVI, etc

Scripting in Python, Perl, VB, etc would be a plus.

Must be a good team player and work with cross-functional teams within the organization. Also, leverage TI support teams as well as engineers at production sites to help execute the projects.

Must always do due diligence in decision making and be able to make good decisions with limited data in a time crunch.

Must be able to fully own the device ATE characterization, including GRR, Spike Check, Data Collection/Processing, Analysis, Review, Upload to Starfish, Proposing Guardband limits, and driving issues to conclusion through working with cross-functional teams.