Job Description

About TI

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!

About the job

This is a challenging position for an experienced high voltage packaging engineer. As a technical leader, you will be defining, designing, developing, qualifying and releasing packaging solutions for a range of high-voltage products. These products will be operating over a voltage of 400v to 1200v, using Si LDMOS, GaN, and SiC. Role will include development of single die, MCM, and module solutions using internal TI factories as well as external subcontractors. We are looking for individuals that have in-depth knowledge of these technologies, industry offerings, and reliability of such packages. You will be working with teams that are spread out around the world to create new and innovative solutions.

Responsibilities may include:

Develop new package requirements and maintaining quality of existing packages

Define package requirements for product groups and customer requirements in high voltage power applications

Develop package thermal solutions for application

Perform thermal analysis of package in application

Perform package characterizations including cost effectiveness studies.

Review package development BLR data

Prepare and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies

Prepare application notes to utilize package and optimize thermal performance

Qualifications

Basic Qualifications:

BS in Mechanical or Electrical Engineering, Physics, Material Science, or related field.

5 years experience in high voltage semiconductor packaging, MCM/SIP/power module design, material or assembly flow development for high-voltage (>400V) integrated circuits. Knowledge of high-power discrete components (such as SiC, GaN, MOSFETs and IGBTs) is a plus.

Understanding of the end applications related to high voltage electronic devices (500v to 1200v)

Track record of development work leading to volume production for one or more of the following items: assembly or front end process flow, material or method development, package or component design

Demonstrated analytical and problem solving skills

Knowledge of industry high-voltage and power package trends, industry standards, supply chain, and reliability requirements.

Familiar with the cost structures of the materials, components, and services in Package assembly.

Basic understanding of cost of manufacturing of high voltage modules.

Test vehicle design, advanced prototyping, evaluation and failure analysis

Proficient in package/module design, structural, thermal and electrical modeling

Ability to follow disciplined work flow targeting for delivery of milestones on-time.

Ability to work with significant sense of urgency and commitment to achieve tangible results and outcomes.

Preferred Qualifications:

MS/PhD in Mechanical Engineering, Electrical Engineering, Materials Science or Physics

10 year experience in Semiconductor High-voltage package development, reliability characterization and modeling, test development or qualification support

Working experience with industry partners (subcontractors, suppliers, and customers)