Job Description

Job Description

At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. Were committed to fostering an environment for every teammate thats welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.The Boeing Defense, Space and Security, Space and Launch division is seeking anSenior Electronics Packaging Engineer (level 5 )to provide support to the Electronic Products diverse team located in El Segundo, CA. Part of Boeing Space and Launch, the Electronic Products team manages the electronic products within the companys major commercial and government satellite and ground programs for communications and national defense, as well as within the companys other programs across the world, including commercial and government avionics, space exploration, and multiple defense vehicles.
Position Overview

TheSenior Electronics Packaging Engineer coordinates and leads various other engineering and non-engineering groups in order to analyze customer and system requirements to develop basic architectural approaches and detailed specifications for various electronic products, as well as to develop high-level and detailed designs consistent with requirements and specifications. This position validates designs through various methods of review, testing, and analysis, and identifies, tracks, and statuses technical performance metrics to measure progress and ensure compliance with requirements. The analytical methods used include finite element models/simulationsand hand calculations, which are done throughout the product life-cycle. Additionally, this position supports Supplier Management with make/buy recommendations and other technical services of limited scope, provides engineering support throughout the lifecycle of the product, and investigates emerging technologies to develop concepts for future product designs to meet projected requirements. This position also supports knowledge sharing within and across teams and develops new processes and process improvements to reduce cycle time, continuously innovate on the products and processes, and ensure product quality.

Position Responsibilities

* Resolves complex issues on critical programs related to architectural approaches, requirements, specifications and design.
* Leads technical aspect of proposal preparation. Identifies critical performance measures and develops processes for computing them.
* Leads activities in support of Supplier Management with make/buy recommendations and other technical services.
* Coordinates engineering support throughout the lifecycle of the product.
* Develops new concepts for future product designs to meet projected requirements.
* Recommends and manages technology insertion. Works under consultative direction.
* Leads structural design and configuration development by performing trade studies to optimize structure and meet program requirements
* Oversees and performs detailed structural and thermal analysis using hand calculations and analysis tools
* Develops and executes plans in order to meet customer commitments (budget and schedule)
* Leads development of Company make/buy strategy for electronic products.
* Develops, designs and conducts research that results in new product offerings or business opportunities.
* Leads majorroot cause corrective action (RCCA)activities pertaining to product failures.
* Represents the Company in industry research and development activity related various aspects of electronic products design, manufacture and test.
* Works independently.This position requires the ability to obtain Top Secret U.S. Security Clearance and successfully complete T5 (SSBI) post-start, for which the U.S. Government requires U.S. Citizenship.

Basic Qualifications (Required Skills and Experience)

* Bachelors, Masters or Doctorate of Science degree from an accredited course of study, in engineering
* 5or more years experience with solder fatigue
* 5or more years experience with thermal and structural analysis
* 5 or more years experience in a leadership role, leading teams or projects to successful completion
* 5 or more years experience with both Commercial and Defense platforms and customersPreferred Qualifications (Desired Skills and Experience)

* Experience with Space based systems.
* 15 or more years of electronics packaging experience
* Current/active US Security clearance is preferred.
* Masters degree or higher in engineering

Typical Education & Experience:Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 14 or more years related work experience or an equivalent combination of technical education and experience (e.g. PhD9 years related work experience, Master12 years related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation

Relocation

This position offers relocation based on candidate eligibility.Boeingis a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.This position is for 1st shift.Referral to this job is eligible for bonus.

Experience Level

Individual Contributor

Contingent Upon Program Award:
No, this position is not contingent upon program award

Schedule:

Full time

Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.