Job Description

Job Description

Join the Datacenter Thermal Mechanical Solutions team. Candidate will assist in the development of thermal modeling, process automation, documentation development, and or other work supporting CPU thermal/mechanical solution development for various server market segments by working with a team of cross-site architects, mechanical, thermal, electrical and structural engineers. Conditions may require candidate to work virtually / remotely.

The ideal candidate should exhibit the following behavioral traits:

* Highly motivated individual willing to work under pressure and deliver high quality results on time.

* Excellent written and verbal communication skills.

* Strong quantitative, analytical, problem solving and conflict resolution skills.

* Effective prioritization and time management skills.

* Stakeholder management, strong collaboration, tolerance for ambiguity and critical thinking.

* Excellent teamwork ethics skills.

* Willing to work in an agile work environment with a fast-paced task flow.

Qualifications

Candidate must possess minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. This is an entry level position and will be compensated accordingly.

This position is not eligible for employment-based visa/immigration sponsorship. Intel sponsors individuals for employment-based visas for positions where we experience a shortage of US Workers. These skills shortage roles are typically STEM contributing positions requiring a Master's or PhD degree, or a Bachelors degree with three years related job experience. This position does not qualify for Intel Sponsorship because it is either (1) a non-STEM contributing position, or (2) a STEM position that only requires a Bachelors degree and less than three years experience.

Minimum Qualifications:
Candidate must be pursuing a BS degree in Mechanical Engineering program and at least at the sophomore level with a minimum of 3.5 cumulative GPA. Length of internship: Minimum of 3 months and could be extended to 6 months.

Minimum 3+ months of experience or equivalent coursework in the following areas:

* Python 3, Labview, Matlab or similar programming capability

* Knowledge of Computational Fluid Dynamics (CFD) tools like FloTherm or IcePak

* Knowledge of basic heat transfer processes

* Knowledge of server computer system layout and basic component architecture

* Knowledge of modeling of air-cooled and liquid cooled server systems

Inside this Business Group
The Data Platforms Engineering and Architecture (DPEA) Group invents, designs & builds the world's most critical computing platforms which fuel Intel's most important business and solve the world's most fundamental problems. DPEA enables that data center which is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologiesspanning software, processors, storage, I/O, and networking solutionsthat fuel cloud, communications, enterprise, and government data centers around the world.

Other Locations

Virtual US and Canada

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USInternJR0157165Hillsboro