Job Description
About the job:
As Physical Design Engineer youll be responsible for:
* Creates custom layouts bottoms-up elements of chip design including but not limited to FET, cell, and block-level custom layouts, Functional Unit Block (FUB) level floor plans, abstract view generation, RC extraction, and schematic to layout verification and debug using phases of physical design development including parasitic extraction, floor planning, full-chip assembly, and verification.
* Troubleshoots a wide variety up to and including difficult design issues and applied proactive intervention.
* Requires good knowledge and practical application of methodologies and physical design
About the Organization:
Our organization is one of the core team of Technology Research and Development BU at Intel. The team works on High Density, High Performance, Low Power SRAM and other Memory designs to deliver custom physical designs on cutting edge technology. We serve to technology certification of Intel process which needs problem solving and risk-taking skills to make SRAM physical designs work.
Important behavior traits were looking for:
* Outstanding leadership, communication and influencing skills
* Confidently represent teams in crucial project meetings and events
* Problem solving and analytical skills
* Work well in a team environment
* Hierarchical Layout planning and integration skills
This is an entry level position and compensation will be given accordingly.
Qualifications
You must possess minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences.
Minimum Qualifications
The candidate must have a bachelor's degree in Electrical Engineering (EE), Computer Engineering (CE), Computer Science (CS) or a related field with 6+ months of industry experience OR a masters degree in Electrical Engineering (EE), Computer Engineering (CE), Computer Science (CS) or a related field.
Your industry experience should be in the following areas:
* Electronic circuit functionality and behaviors
* Complementary Metal-Oxide Semiconductor (CMOS) and Very Large-Scale Integration (VLSI) component design principles.
Preferred Qualifications and skills:
* Custom layout design skills (SRAM, Register File, Analog)
* Hierarchical Layout planning and integration skills.
* Programming skills in Tcl, SKILL, Perl, Python
* ICV/Calibre runset verification flow skills.
* Knowledge of CAD layout software (Cadence Virtuoso VXL and ICC2 layout tools)
* Knowledge in Unix/Linux operating systems
designenablement
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth
Other Locations
US, Arizona, Phoenix
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
USCollege GradJR0158945Hillsboro
Santa Clara, CA
Intel Corporation offers computing, networking, data storage, and communication solutions worldwide. It operates through Client Computing Group, Data Center Group, Internet of Things Group, Non-Volatile Memory Solutions Group, Programmable Solutions Group, and All Other segments. The company offers microprocessors, and system-on-chip and multichip packaging products.
It also provides NAND flash memory products primarily used in solid-state drives; and programmable semiconductors and related products for communications, data center, industrial, and military markets. In addition, the company develops computer vision and machine learning, data analysis, localization, and mapping for advanced driver assistance systems and autonomous driving. Its platforms are used in notebooks, systems, and desktops; cloud, enterprise, and communication infrastructure market segments; and retail, automotive, industrial, and various other embedded applications.
It serves original equipment manufacturers, original design manufacturers, industrial and communication equipment manufacturers, and cloud service providers. Intel Corporation has a collaboration with Telefonaktiebolaget LM Ericsson (publ) to develop software defined infrastructure for network functions virtualization, distributed cloud, and 5G applications. The company was founded in 1968 and is based in Santa Clara, California.