Job Description

Job Description

The Process Technology Development (TD) Engineer role may entail process and equipment development supporting 1) certification of Intel next gen packaging solutions and 2) assembly of prototypes of next generation Intel products.

Other aspects of the internship project may include defining and establishing process flow, procedures, and equipment configuration for a process module within the printed circuit board assembly manufacturing development line.

Additional roles include developing material, tooling, fixtures, and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

The intern will work with product engineers and the new package platform owners to plan and conduct experiments to fully characterize the process throughout the development cycle and:

- Be involved in driving improvements on yield, process stability and/or capability (PCS), productivity and safety and/or ergonomic over variables such as material, method, equipment, environment and operating personnel.
- Be expected to develop solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.

The candidate should also exhibit the following behavioral traits and/or skills:

- Ability to work across multi culture and/or multi geography
- Advanced interpersonal, communication, problem solving, detail orientation skills
- Technical leadership and teamwork skills

This is an internship and compensation will be given accordingly based on candidate education level and internship duration.

Qualifications

You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum requirements

- Candidate must be pursuing a master's degree or PhD degree in Electrical Engineering or Mechanical Engineering or Chemical Engineering or Industrial Engineering or Material Science, or related discipline and 3+ months of experience.

Preferred qualifications:

Experience in any of the following:

-Surface mount technologies to assemble printed circuit boards, which utilizes processes related to solder paste screen printing, component placement, Surface-Mount Technology (SMT) reflow, wave solder and test.

- Failure Modes and Effects Analysis (FMEA), Statistical Process Control (SPC), statistical methods, and data analysis methods.

-Manufacturing and/or circuit board assembling technology development (TD)

Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USInternJR0158309Hillsboro