Intel

Packaging Research and Development Engineer

Posted on: 6 Feb 2021

Hillsboro, OR

Job Description

Job Description

Materials Technology Development (MTD) is looking for a Packaging R&D Engineer candidate to be part of the Assembly and Test Technology Development (ATTD).

In this role, the individual will be responsible for, but not limited to:

* Pathfinding, developing, qualifying, and ramping materials to production for use in products across multiple segments
* Proposing new materials and developing materials target specifications based on alignment with key stakeholders
* Conducting fundamental studies and performing experiments to characterize materials, identify potential failure modes, understand the structure-property-performance interactions, assess feasibility of material use on product, and make material technology recommendations
* Working in close collaboration with materials suppliers to develop and source materials formulations that meet technology, quality, availability, and cost targets
* Developing a fundamental understanding of Intel's assembly process and materials interactions and impact on product performance
* Collaborating closely Equipment and Process Engineering to build material technologies on test vehicles and products, and assessing their performance

The candidate should also exhibit the following behavioral traits and/or skills:

* Technical problem-solving and verbal and written communication skills
* Demonstrated fast-learning skills and expertise in their technical field
* Willingness to collaborate effectively across multiple teams

This is an entry level position and compensation will be given accordingly.

Qualifications

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Requirements

* Possess a PhD degree in Metallurgy or Materials Science or Polymer Science or Polymer Chemistry or Physics or Chemical Engineering and 1+ year's of experience
* 1+ years of experience with data analysis and statistical principles

Preferred

1+ years of experience with:

* General semiconductor packaging and assembly technologies
* Communicating with suppliers and driving supplier technology development

Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USCollege GradJR0156091Hillsboro

Intel

Santa Clara, CA

Intel Corporation offers computing, networking, data storage, and communication solutions worldwide. It operates through Client Computing Group, Data Center Group, Internet of Things Group, Non-Volatile Memory Solutions Group, Programmable Solutions Group, and All Other segments. The company offers microprocessors, and system-on-chip and multichip packaging products.

It also provides NAND flash memory products primarily used in solid-state drives; and programmable semiconductors and related products for communications, data center, industrial, and military markets. In addition, the company develops computer vision and machine learning, data analysis, localization, and mapping for advanced driver assistance systems and autonomous driving. Its platforms are used in notebooks, systems, and desktops; cloud, enterprise, and communication infrastructure market segments; and retail, automotive, industrial, and various other embedded applications.

It serves original equipment manufacturers, original design manufacturers, industrial and communication equipment manufacturers, and cloud service providers. Intel Corporation has a collaboration with Telefonaktiebolaget LM Ericsson (publ) to develop software defined infrastructure for network functions virtualization, distributed cloud, and 5G applications. The company was founded in 1968 and is based in Santa Clara, California.

  • Industry
    Information Technology
  • No. of Employees
    107,400
  • Jobs Posted
    6311