Job Description

Job Description

Microelectronic Packaging Engineers in Assembly and Test Technology Development (ATTD) provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

This position will be responsible for:

* Test vehicle package design used for packaging technology development.
* Define overall package performance and specification and realizes technology certification through layout design.
* Provide consultation concerning packaging problems and improvements in the packaging process.
* Respond to customer/client requests or events as they occur.
* Develop solutions to problems utilizing formal education and judgment.

The ideal candidate must exhibit the following behavioral traits:

* Proven team player
* Good communication
* Stakeholder management skills.

Qualifications

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Requirements:

* Possess a bachelor's with 2yrs of experience or master's degree with no experience in Electrical Engineering or Mechanical Engineering or related disciplines. Prior experience and/or exposure with physical design (Package/PCB)
* Familiarity with package design tools like Auto CAD, Cadence and/or Mentor Graphics

Preferred qualifications:

* 2+ years of experience related to this position Experience in Package/Substrate technology development
* Familiarity with Package layout extraction and Electrical modeling/simulation tools such as PowerDC (Direct Current), Hyperlynx, Quasi-Three-Dimensional (Q3D), and High Frequency Structure Simulator (HFSS)
* Demonstrated scripting using languages such as Python, Visual Basic (VB), C and other languages

Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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