Job Description

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

Job Overview:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

Job Overview:

The IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc...). Job responsibilities for this position include package selection, package design, and package EE modeling. This involves optimizing system co-design of IC-PKG-PCB die keeping in mind package footprint/height constraints, IC floor-planning, PCB, high-speed signal integrity , power distribution network and thermal constraints.

Additional responsibilities:

* IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern/assignment

* System level co-design methodology of IC, Package and PCB/Board

* Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost

* Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs

* Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels

* Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
Minimum Qualifications:

- Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.

- 2+ years Hardware Engineering experience or related work experience.

Preferred Qualifications:

- Experience in IO + PKG + PCB SI/PI modeling, co-simulation and analysis

- Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory

- Experience in IC package, SIP module and/or PCB selection, design and layout.

- Experience in Pinmap optimization of optimal package, SIP module and/or PCB designs

- Experience in IC, package, PCB co-design for system performance optimization.

- Hands on experience with Cadence SIP and/or Mentor Xpedition.

- Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.

- Familiar with assembly and substrate manufacturing process is a plus

Education Requirements:

Bachelor's Electrical Engineering and/or Mechanical Engineering.

Preferred: Master's, Electrical Engineering.

Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport

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