Job Description

Description:
1.) Works under direction and from production schedules, manufacturing procedures, process plans and written instruction.

2.) Perform a variety of routine tests on production runs of microelectronics parts using test fixtures, and sorts product using various instruments. Test equipment utilized is manual, semi-automatic and automatic or probe-set bench set up.

3.) Operates and adjusts semi conductor die bond machine to bond die into packages per micro-circuit layout drawing. Requires careful handling for proper placement and alignment of dies. Requires the use of microscope and micro manipulators for precise control of die placement.

4.) Test silicon wafers using semi-automatic wafer probe apparatus, aligns wafers in apparatus, monitors equipment operation.

5.) Loads and unloads components into burn in sockets and further loads those sockets into burn in ovens. Loads and unloads test units in test computers, test fixtures and automatic handlers

6.) Operates and adjusts wire bond apparatus to bond fine wires from components to pads of substrate, from substrate to package leads, or from die directly to package leads. Involves working to microcircuit layout drawings; incumbent is responsible for proper wire dress, bond appearance and bond strength; and apparatus used includes microscope and micro-manipulators for precise movement and control.

7.) Sets up and operates manual, semi-automatic and automatic equipment such as package sealers, screen printers, wire bonders, laser trimmers and other similar microelectronics fabrication. Loads, monitors operation and unloads components from ovens, cleaning stations and marking machines.

8.) Checks product being fabricated/assembled for conformance to specifications and standard. Uses microscopes, leak detectors and other similar equipment which may require adjustment and involve a series of numerical and dial readouts and some interpretation.

9.) Performs specified rework involving removal and replacement of components, removal and repair of wires and/or wire boards.

10.) Flexibility to be trained in multiple Microelectronics processes including those that require use of chemicals.

11.) Visual acuity required to 20/20 correctable with a microscope, high level of manual dexterity, ability to lift 10 pounds minimum, basic computer skills. Reads and interprets engineering drawings.

12.) Significant attention to detail for production activities and documentation to maintain compliance with Mil. Standard requirements.

Must have the ability to work 1st, 2nd, or 3rd shift according to the collective bargaining agreement between Lockheed Martin and the UAW.

MFCProdOpsQMS

Lockheed Martin supports a variety of alternate work schedules that provide additional flexibility to our employees and management. Schedules range from standard 40 hours over a five day work week while others may be condensed. These condensed schedules provide employees with additional day(s) away from the office and are in addition to our Paid Time off benefits. Employee will be required to work multiple shifts and schedules per the UAW Collective Bargaining Agreement.
Basic Qualifications:
Ability to set-up, operate, and adjust microelectronic production equipment.
Ability to read and follow process plans and work in a team environment. Ability to obtain solder certification.
Must have the ability to work 1st, 2nd, or 3rd shift according to the collective bargaining agreement.
Desired Skills:
Experience setting up, operating and adjusting a variety of microelectronics production equipment used to perform required operations and test on production runs of microelectronic devices/wafers.
Experience setting up and operating semi-automatic and automatic equipment. Other Important Information You Should Know Expression of Interest: By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match. Should this match be identified you may be contacted for this and future openings.Telecommute: The work associated with this position will be performed at the designated Lockheed Martin facility. Situational telecommuting may be considered and authorized at the discretion of your leader and based upon the role.Work Schedules: Lockheed Martin supports a variety of alternate work schedules that provide additional flexibility to our employees. Schedules range from standard 40 hours over a five day work week while others may be condensed. These condensed schedules provide employees with additional time away from the office and are in addition to our Paid Time off benefits.Schedule for this Position: 4x10 hour day, 3 days off per weekClearance Level: None Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, age, protected veteran status, or disability status. Join us at Lockheed Martin, where your mission is ours. Our customers tackle the hardest missions. Those that demand extraordinary amounts of courage, resilience and precision. Theyre dangerous. Critical. Sometimes they even provide an opportunity to change the world and save lives. Those are the missions we care about.

As a leading technology innovation company, Lockheed Martins vast team works with partners around the world to bring proven performance to our customers toughest challenges. Lockheed Martin has employees based in many states throughout the U.S., and Internationally, with business locations in many nations and territories.Experience Level: Hourly/Non-ExemptBusiness Unit: MISSILES AND FIRE CONTROLRelocation Available: NoCareer Area: Manufacturing Type: Full-TimeVirtual Location: no Shift: Second