Job Description

Job Description

About the job:

Package Research Engineer in Intel Components Research will be expected to:

* Be responsible for the electrical design, analysis, and testing of electronic packages and systems including signal and power integrity investigations.
* Perform electromagnetic (EM) simulation and design of RF/mm Wave systems
* Conduct and develop new characterization techniques for high frequency measurements of novel materials
* Propose and prototype solutions to problems utilizing formal education and judgment.
* Provide project management of signaling research for integrated circuit or semiconductor assemblies and systems

About the team:

This job is part of Intels Component Research Package and Systems Solutions group within the Technology Development organization. You would be joining a multidisciplinary team of research engineers charged with developing novel technologies and package architectures to enable continued semiconductor scaling, mm-wave communications at various length scales and differentiating capabilities within packaging, such as in situ accelerometers and sensors. The ideal candidate for this position would have a strong interest in both modeling and prototype development (Proof-of-Concept). Hands on measurements of PoCs will be performed in our state-of-the art laboratory with capabilities covering the spectrum ranging from DC to 330GHz. Research is conducted both internally and in partnership with Universities and consortia to deliver industry leading technology solutions to meet Intels future product needs.

The candidate should also exhibit the following behavioral traits and/or skills and/or requirements:

* Technical innovation and deliver results for complex and time critical technical projects

This is an entry level position and compensation will be given accordingly.

Qualifications

You must possess minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences.

Minimum requirements:

* Selected candidate must have a PhD degree in Electrical Engineering or Physics or Optical Engineering or related field
* Lead- and co-authored research publications in Engineering and/or Physics Journals and/or Conferences.
* 6+ months experience with electronic systems test in a laboratory environment (semiconductor prober, Vector Network Analyzer, Oscilloscopes, TDR)
* 6+ months experience with electromagnetic (EM) theory, EM simulation and design for RF/mmWave/sub-THz or optical systems

Preferred Qualifications

* Familiarity with signal and power integrity analysis including but not limited to time and frequency-domain circuit analysis, S-parameter modelling, digital baseband processing, power distribution network (PDN) analysis, silicon-package co-design techniques
* Familiarity with advanced semiconductor packaging techniques and methods
* Experience with high speed interconnect system design and/or wireline/wireless systems architecture design
* Experience across analog, high-speed digital, and mm-wave domains
* Developing and prototyping engineering concepts to create novel solutions

Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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